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High-Resolution Multi-Level Induction Coils
Precision patterns can be etched in
almost any material up to a depth of a few microns using ion
beam etching. Depth-to-width ratios can be as much as 5:1
and multi-layer metalizations are feasible. Pattern relief
etching of dielectric substrates, such as glass, is possible
to precise depths of 10 angstroms.
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